KNK Vietnam Co., Ltd

Sn63/Pb37 ElectropureTM is alloyed in a proprietary method resulting in a low drossing, high wetting solder.

• Liquidus 183°C (361°F)
• High Purity
• Low Dross
• Complies with IPC J-STD-006 – Current Rev
• Ingredent: Sn: 63.0% – Pb 37.0%

SN100C is a lead-free silver-free solder alloy.

• Liquidus 227°C (441°F)
• Smooth, Bright Solder Joints
• Bridge-Free Soldering
• Low Cost – Does Not Contain Silver
• Reduced Copper Erosion from Holes, Pads and Tacks
• Dross Rate Similar to Tin-Lead Alloys
• Complies with IPC J-STD-006
• Compositon: Sn: balance – Cu: 0.7% – Ni: 0.05% – Ge: 0.009%

SAC305 lead-free alloy contains 96.5 % tin, 3% silver, and 0.5% copper and is RoHS, REACH and JEIDA compliant. Applications include Wave, Selective, Hand and SMT Reflow Soldering.

• Liquidus 220 Deg.C (428 Deg.F)
• Compatible with all Flux Types
• Excellent Wetting Speed
• Excellent Solderability and Spreading
• Reduced Bridging Versus Sn-Cu Alloys
• Manufactured with AIM Electropure™ Technology
• Complies with IPC J-STD-006
• Composition: Sn: Balance – Ag: 0.3% – Cu: 0.5%