Water-based, alkaline defluxing agent for spray-in-air processes
The MPC®-based cleaning agent is especially suitable for the removal of flux residues from leaded as well as lead-free No-Clean solder pastes and provides shiny solder joints after cleaning without the need for additives. It provides excellent cleaning performance in spray-in-air processes for the cleaning of capillary spaces, e.g. under low standoff components.
Advantages compared to other cleaners：
Suitable for low-standoffs
Especially effective for lead-free No-Clean solder pastes.
Leaves shiny solder joints on assemblies after cleaning without any additional additive
High bath loading capacity ensures extended bath life, low maintenance cost and reduced cost per cleaned part
High bath loading capacity ensures extended bath life, low maintenance cost and reduced cost per cleaned part
Easy to rinse, does not leave any residues on the surfaces
Ensures a void-free underfill and improves the image resolution by removing all tacky fluxes from Flip Chips/CMOS.
Ensures a void-free underfill and improves the image resolution by removing all tacky fluxes from Flip Chips/CMOS.
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