Resonac’s Cleaning Sheet for encapsulation molding dies of semiconductor packages. By placing the sheet between dies and heating it, stains are transferred to the sheet and removed. MERITS
Remove stains with fewer shots than melamine cleaning materials, thereby reducing the cleaning time.
Remove stains in cavities, burrs on dies, and gas stains in air vents.
Environment-friendly cleaning agent prevents damage and corrosion of molding dies.
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