Resonac’s solvent-free die bonding paste (conductive and non-conductive types) bonds chips to leadframes and organic substrates when manufacturing semiconductor packages. Resonac offers a wide-ranging lineup with its die bonding paste holding a large global market share.
MERITS
Low elastic modulus and high adhesive strength realizes greater reliability even for MSL1
Suitable for package on leadframes and organic substrates
Low-cost type using both aluminum and silver filler is also available
High thermal conductivity (17W/m-K) type effective for power devices and modules is lined up
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