Resonac’s epoxy molding compounds seal and protect the areas around the chips of semiconductor packages assembled with various metal lead frames.
Resonac has established a supply system to globally provide these materials from five sites. MERITS
Excellent moisture and thermal shock resistance.
Excellent reflow crack resistance.
Suitable for automotive grade semiconductors by using high-purity materials and strict quality control.
Extensive product lineup satisfies the need for materials with high thermal resistance, heat conductivity, high CTI, etc.
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