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SN63 / PB37 (SN63) - Solder Alloy

Sn63/Pb37 ElectropureTM is alloyed in a proprietary method resulting in a low drossing, high wetting solder.

  • Liquidus 183°C (361°F)
  • High Purity
  • Low Dross
  • Complies with IPC J-STD-006 – Current Rev
  • Ingredent: Sn: 63.0% – Pb 37.0%
SN63 TDS File

SN100C (NAP100) - Lead Free Solder Alloy

SN100C is a lead-free silver-free solder alloy.

  • Liquidus 227°C (441°F)
  • Smooth, Bright Solder Joints
  • Bridge-Free Soldering
  • Low Cost – Does Not Contain Silver
  • Reduced Copper Erosion from Holes, Pads and Tacks
  • Dross Rate Similar to Tin-Lead Alloys
  • Complies with IPC J-STD-006
  • Compositon: Sn: balance – Cu: 0.7% – Ni: 0.05% – Ge: 0.009%
NAP100 TDS File

SAC305 (E9650) - Lead Free Solder Alloy

SAC305 lead-free alloy contains 96.5 % tin, 3% silver, and 0.5% copper and is RoHS, REACH and JEIDA compliant. Applications include Wave, Selective, Hand and SMT Reflow Soldering.

  • Liquidus 220 Deg.C (428 Deg.F)
  • Compatible with all Flux Types
  • Excellent Wetting Speed
  • Excellent Solderability and Spreading
  • Reduced Bridging Versus Sn-Cu Alloys
  • Manufactured with AIM Electropure™ Technology
  • Complies with IPC J-STD-006
  • Composition: Sn: Balance – Ag: 0.3% – Cu: 0.5%
E9650 TDS File

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