Stencil & Misprint Cleaning

Removing solder pastes residues from stencil, screen, nozzle.

When manufacturing electronic assemblies, solder pastes, SMT adhesives or thick film pastes are printed or applied using stencils, pump print stencils or screens. Paste residues and remaining SMT adhesives on stencil surfaces and apertures can lead to misprints resulting in bridging and solder balling issues. For optimum print results, it is necessary to clean the stencils and screens either manually or using an automated stencil cleaning machine.

List of Stencill & Misprint cleaning chemical:

– For Spray in air machine: Vigon SC210, Hydron SC300.

– For Ultrasonic machine: Vigon SC210, Hydron SC300, Zestron SD100

– For Manual cleaning: Zestron SD300.

– For stencil printer wipe systems (underside wiping): Zestron SD100, Zestron SW

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