KNK Vietnam Co., Ltd

Polyimide film-backed silicone adhesive tape with extremely low electrostatic discharge properties.
Product Construction:
Backing Polyimide
Adhesive Silicone
Conventional polyimide tape typically generate over 10,000 volts during use which can damage around electronic components .
The low static 2 can eliminate circuit board degradation.
Detailed technical parameters can be obtained from the customer service staff.

The polyimide film-backed silicone adhesive tape with high temperature resistant.
Tape Thickness:0.055±0.005（mm）
Temperature resistance:280℃/5 minutes

Detailed technical parameters can be obtained from the customer service staff.

Masking Dots
Introduction:
Masking Dots are made of high temperature polyimide film. which are used in masking of circuit boards during wave soldering or other electronic manufacturing processes. It also can be used in powder coating, automotive and transformer manufacturing. Polyimide masking discs have high dielectric strength. Polyimide masking discs offers excellent performance in electrical and thermal insulation.
Polyimide masking discs have 1.2~1.5 mil of silicon adhesive which does not leave any residue. It can withstand temperature up to 280℃.
Applications:
Electrical Insulation, Gold leaf mask of printed circuit boards during wave soldering, transformer and capacitor insulation, powder coating and high temperature applications

The polyimide film-backed silicone adhesive tape with high temperature resistant.
Double-side high-temp resistant adhesive tape
Tape Thickness:0.055±0.005（mm）
Temperature resistance:280℃/5 minutes

Detailed technical parameters can be obtained from the customer service staff.

UV-Tape for Wafer Dicing Main Feature:
1.High adhesion during wafer dicing and low adhesion (non-sticky) after exposed to UV light to make easily chip picked up and avoids chip flying, no adhesive residue.
2.Be non-sticky quickly when exposed to UV light.
3.Full dicing of wafer, no wafer particle wastage, Less wafer fragment.
4.High adhesion to make no shift and falling during chip picked &placed.
5.Excellent wafer dicing and chip pick &place.