Water-based stencil cleaner for the removal of solder pastes and SMT adhesives

VIGON® SC 210 is a water-based cleaning agent specifically developed for cleaning SMT metal masks and stencils. This chemical effectively removes solder paste and SMT adhesive in a single process, eliminating the need for rinsing with water. It delivers optimal cleaning results even at low washing temperatures of 18°C/64°F. VIGON® SC 210 is designed for use in ultrasonic and high-pressure spray systems.

Advantages compared to other cleaners：

  • Shows constantly good cleaning results at temperatures between 18-40°C/64-104°F.
  • Low VOC content
  • Excellent material compatibility
  • No flash point
  • No foaming, low odor and germ-free
  • Can also be used to remove adhesives from tools, especially from dispensing needles.

Application

  • Stencil cleaning
  • Misprint cleaning

Process:

  • Ultrasonic
  • Spray-in-air

Contamination:

  • Solder paste (unsoldered)
  • SMT or conductive adhesives
  • Adhesives on tool, needles
Process
Result
Technical Information

CUSTOMER