Reflow oven cleaner

VIGON® RC 303 was specifically developed to remove all types of baked-on flux residues from reflow and wave solder equipment. It reliably removes re-condensed fluxes and emissions from assemblies. The medium does not contain any ingredients which could leave residues on the oven surfaces. This avoids harmful condensation on the assembly surfaces after restarts.

As the successor to VIGON® RC 101, VIGON® RC 303 delivers an improved cleaning performance with the same high level of operator safety.

Advantages compared to other cleaners:

  • Improved cleaning performance
  • Mild formulation, high operator safety
  • No flash point
  • Environmentally friendly
  • No special labeling is required
  • Little odor
  • Excellent material compatibility with aluminum and epoxy surfaces

Area of Specific Application:

  • Reflow oven cleaning
  • Wave solder machine cleaning
  • Tool cleaning

Process:

  • Manual Cleaning
  • Automated cleaning of conveyor fingers in wave solder ovens

Contamination:

  • Baked-on fluxes
  • Fumigation contamination
  • MPC Technology


Process:

Manual Cleaning
Result
Technical Infomation

CUSTOMER