For reflow ovens and wave solder systems, water-based

Based on the MPC® Technology, VIGON® RC 101 was specifically developed to remove all types of baked-on flux residues from reflow and wave solder equipment. It reliably removes re-condensated fluxes and emissions from assemblies.

Advantages compared to other cleaners:

  • Has no flash point and therefore can be applied directly onto cold or warm surfaces (30 – 40 °C / 86 – 104 °F)
  • The medium does not contain any ingredients, which could leave residues on the oven surfaces. This avoids harmful condensations on the assembly surfaces after restarts
  • Due to the short soaking time, a quick and efficient cleaning process can be achieved and long machine downtimes can be avoided

Area of Specific Application:

  • Reflow oven cleaning
  • Wave solder machine cleaning
  • Tool cleaning

Process:

  • Manual Cleaning
  • Automated cleaning of conveyor fingers in wave solder ovens

Contamination:

  • Baked-on fluxes
  • Fumigation contamination
  • MPC Technology


Process:

Manual Cleaning
Result
Technical Infomation

CUSTOMER